Next-Generation Laser Technologies for the Semiconductor Industry
The semiconductor industry demands higher precision and efficiency, and LASER-PRO is delivering state-of-the-art laser solutions for chip manufacturing, through-silicon vias (TSV), and advanced lithography. Our focus aligns with the EU Chips Act, driving innovation in deep-ultraviolet (DUV) laser technology and heterogeneous integration.
With the booming demand for high-performance semiconductors, LASER-PRO is advancing laser applications in chip fabrication, packaging, and lithography to meet the needs of next-generation electronics. Our focus includes:
- Deep-Ultraviolet (DUV) Laser Technology: Developing high-energy DUV lasers for advanced chip manufacturing and inspection, supporting the EU’s CHIPS Act initiative.
- Through-Silicon Vias (TSV) and Selective Laser Processing: Enhancing chip interconnectivity by using laser drilling and metal deposition techniques for high-density semiconductor integration.
- Heterogeneous Integration & Packaging: Applying laser-based selective metal plating to enable the next wave of miniaturized, high-performance electronic devices.
- Laser-Assisted Semiconductor Manufacturing: Using precision laser machining to improve yield rates, reduce defects, and increase energy efficiency in semiconductor production.
These advancements position LASER-PRO as a key player in future-proofing Europe’s semiconductor industry, ensuring a strong, resilient, and technologically sovereign supply chain.
